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Full Report Description of this Market is available at:
The report points out that the robust growth in the semiconductor
industry and increased investments in research and education
infrastructure are expected to boost the growth of the global failure
analysis equipment market. However, low adoption rate due to high
cost of equipment will restrain the market during the forecast
period. The overall market has a huge opportunity to grow with the
growing innovative failure analysis techniques such as SDR, SQUID,
XIVA, EMMI, and OBIRCH.
On the basis of equipment, the report categorizes the global failure
analysis equipment market in the semiconductor industry into
transmission electron microscope, (TEM), scanning electron microscope
(SEM), dual beam (FIB/ SEM) systems, and focused ion beam (FIB)
systems. In 2013, the focused ion beam (FIB) systems contributed
significantly towards the market revenue owing to the diverse usage
of these systems. During the forecast period, the dual beam systems
segment is expected to register the fastest growth, expanding at a
CAGR of 5.8%.
According to customers, the report segments the global failure
analysis equipment market in the semiconductor industry into fabless
FA labs, fab FA labs, specialty labs, and others. Fab FA labs provide
world-class analysis with the assistance of multi-disciplinary and
skilled analysis teams.
The report studies the failure analysis equipment market in the
semiconductor industry across four key regions: Europe, North
America, Asia Pacific, and Rest of the World. In 2013, Asia Pacific
accounted for over 50% of the market and was the biggest revenue
generator. The rapid growth of this regional market can be attributed
to the development of semiconductor technologies in countries such as
China.
The report describes the competitive landscape of the global failure
analysis equipment market in the semiconductor industry and profiles
some of the key players in the market such as Hitachi
High-Technologies Corporation, FEI, Carl Zeiss SMT GmbH, and JEOL
Ltd. The report further provides insightful information about the key
players including their product portfolio, business strategy,
financial overview, and recent developments. Through SWOT analysis,
the report analyzes the growth opportunities for the market players
during the forecast horizon.
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Global failure analysis equipment market in the semiconductor
industry has been segmented as:
Failure analysis equipment market in semiconductor industry: By
geography
> North America
> Europe
> Asia Pacific
> RoW
Failure analysis equipment market in semiconductor industry: By
equipment
> Scanning electron microscope (SEM)
> Transmission electron microscope (TEM)
> Focused Ion Beam system (FIB)
> Dual Beam (FIB/SEM) systems
Failure analysis equipment market in semiconductor industry: By
technology
> Transmission electron microscopy
> Scanning electron microscopy
> Scanning Transmission electron microscopy (STEM)
> X-ray imaging
> Nanoprobing
> Laser voltage imaging (LVI)
> Focused ion beam (FIB)
> Broad ion milling (BIM)
> Secondary ion mass spectroscopy (SIMS)
> Energy dispersive X-ray spectroscopy (EDX)
> Reactive ion etching (RIE)
> Chemical mechanical planarization (CMP)
Failure analysis equipment market in semiconductor industry: By
application
> Defect localization
> Defect characterization
> Others
Failure analysis equipment market in semiconductor industry: By
customers
> Fab FA labs
> Fabless FA labs
> Specialty labs
> Others
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