Radiation hardening
is a process in which the electronic components and semiconductors
are made resistant to malfunctions caused due to electromagnetic
radiation and particle radiation. These radiations are classified
under ionizing radiation and they generally occur at high altitude,
outer space, nuclear reactors and during nuclear warfare and nuclear
accidents. Majority of the semiconductors and electronic components
are vulnerable to such radiation effects; thus, to reduce the
susceptibility, the manufacturing and designing of these
semiconductors and electronic components is varied from their
non-hardened counterparts. However, owing to the extensive cost
involved in testing and developing radiation-tolerant designs of
microelectronic chip, the radiation-hardened electronic and
semiconductors have a propensity to lag behind in terms of recent
developments. Radiation-hardened electronics and semiconductors are
tested using several resultant effect tests such as total ionizing
dose, neutron and proton displacement damage, single event effects
and enhanced low dose rate effects.
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Radiation Hardened Electronics and Semiconductor Market report at:
The environments at
high altitude comprises high level of ionizing radiation, as a
result, there are several challenges for the designers and
manufactures of the electronics and semiconductor devices that can
sustain the radiation effects. The major problem caused due to such
radiations is signal spikes and electronic noise. These noise and
spikes can be generated by a single charge particle that is capable
of knocking thousands of loose electrons. This can in turn result in
inaccuracies in implementation/execution of integrated digital
circuits used in spacecrafts, satellites, military aircraft and
nuclear weapons, and power stations. Owing to the demand for
integrated digital circuits for such critical applications, it is
important for the manufacturers to implement radiation hardening
techniques to ensure that the components produced are resistant to
radiations.
The radiation
hardening techniques are classified under two categories namely,
physical hardening and logical hardening. The physical hardening
techniques include manufacturing the electronic components using
insulating substrates such as silicon on insulator and silicon on
sapphire. Additionally, bipolar integrated circuits, magneto
resistive random access memory, shielding packages and capacitor
based dynamic random access memory are the major electronic
components that are radiation hardened. The logical hardening
techniques includes parity checking, using redundant elements, using
hardened latches and using watchdog timer to reduce the impact of
radiation on the electronic circuits.
The radiation
hardened electronics and semiconductors is primarily driven by the
increasing demand for communication satellites which results is high
demand for radiation hardened components. Moreover, several countries
investing on the space projects to launch various satellites in outer
space is further propelling the demand for radiation hardened
electronic components and semiconductors. However, the major
challenges for the manufacturers of these components is the demand
for highly customized components and high cost involved to set-up the
testing and developing facilities for such components. Conversely,
with the increasing investments in research and development of
electronics and semiconductors, it is expected that the impact of
such challenges will minimize over the coming years.
The radiation
hardened electronics and semiconductors market is segmented on the
basis of applications and geography. The application segment
comprises aerospace applications, defense applications and space
applications. The space applications are further classified as
commercial applications and military applications. The radiation
hardened electronics and semiconductors market is dominated by
players such as BAE Systems, Honeywell International, Inc., Microsemi
Corporation, Xilinx Corporation, Atmel Corporation, Maxwell
Technologies, Intersill Corp., Texas Instruments, Inc., Linear
Technology Corp. and ST Microelectronics.
This report is a
complete study of current trends in the market, industry growth
drivers, and restraints. It provides market projections for the
coming years. It includes analysis of recent developments in
technology, Porter’s five force model analysis and detailed
profiles of top industry players. The report also includes a review
of micro and macro factors essential for the existing market players
and new entrants along with detailed value chain analysis.
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